Research & Development in Accelerated Life Testing

Capabilities

Custom Measurements

Mechanical, thermal, and physical properties of small-scaled materials and systems in relationship with their chemistry and microstructure — using tailor-made testing systems and optimized sample geometries.

• Chemical & microstructural characterization — failure analysis via optical, scanning- and transmission electron microscopy
• Static & quasi-static properties — time- and temperature-dependent: elastic properties, tensile, bending, creep
• Adhesion & delamination — fracture-mechanics-based methods (4-point bending, nano-indentation) for thin films and multilayers
• Fatigue & crack growth — low to very high cycle fatigue under various loading modes
• Ultrasonic fatigue testing — up to the gigacycle range
• FE simulations — testing conditions, sample design, stress/strain distribution calculations
• Fatigue life modelling — lifetime prediction and modelling
• Accelerated mechanical testing of interconnects — rapid qualification of solder joints, wire bonds, and other microelectronic interconnects using high-frequency fatigue methods

Exemplary Test Structures

Laboratory

Testing Facilities

Our testing facilities include 20 and 36 kHz ultrasonic fatigue systems for high cycle tension–compression and bending tests with in situ crack monitoring. Dynamic fatigue testing machine (≤250Hz) with high load capacity. Electromagnetic (≤10 kHz) and piezoelectric shakers (≤100 kHz). Micro tensile machines (1–1000 N) and universal testing machine for static and quasi static mechanical testing. Additional tools include a wire bonder and tester with BAMFIT fatigue testing, laser Doppler vibrometers, a broadband optical microphone for acoustic emission measurements.

We provide solutions for a wide range of industries:

With many years of expertise and numerous successful projects, our team supports customers in key sectors including Microelectronics, Automotive, Electronics Assembly & Manufacturing and Medical Technology.