top of page
We offer:
-
Material testing and characterization with focus on small-scaled materials by using state of the art and customized testing methods.
-
Development of testing methods and prototypes for accelerated reliability testing for rapid qualification, lifetime determination and screening of microsystems and components.
-
Support & consulting in research and development
solder -substrate interface
die attach fatigue crack
nano grains
solder -substrate interface
1/13
R&D
WE OFFER INVESTIGATIONS ON A BROAD RANGE OF MATERIALS AND STRUCTURES:
-
Small scaled metallic and non-metallic materials and structures like foils, wires, thin films,...
-
Structural bulk materials
-
Electronic components and systems and MEMS
-
Medical implants
Services
Mechanical, thermal and physical properties of small-scaled materials and systems in relationship with their chemistry and microstructure by using tailor-made testing systems and designing optimized sample geometries
-
Chemical and microstructural characterization and failure analysis (Optical, scanning- and transmission electron microscopic investigations)
-
Static and quasi-static time and temperature dependent material properties (Elastic properties, tensile, bending, creep, …)
-
Adhesion properties and delamination behavior of thin films and multilayers by using fracture mechanics based methods (e.g. 4 point bending, nano-indentation techniques,..)
-
Fatigue, degradation and crack growth investigations in the range of low to very high cycle fatigue under various loading modes.
-
Ultrasonic fatigue testing up to gigacycle range
-
Finite element simulations (determination of the required testing conditions, sample design, calculation of stress/strain distribution in the test structures,…)
-
Fatigue life modelling and prediction
Examplary test structures:
-
Thin films on rigid or flexible substrates
-
Free-standing foils, µ-wires, fibres
-
Miniaturized specimens prepared out of bulk materials
-
Various kinds of microelectronic interconnects like solder-joints, wire bonds,...
-
Coated systems including functional coatings as well as structural ones (hard, anti-wear coatings, PVD and CVD layers)
-
Multilayered miniaturized components and microsystems
Prototyping
Accelerated Reliability Testing
AMT principles-1
AMT principles-2
AMT principles-3
AMT principles-1
1/3
-
We develop customized accelerated lifetime testing equipment for assessment and rapid evaluation of a variety of electronic components and micro-systems.
-
Our innovative accelerated fatigue testing methods enable the determination of fatigue life in a very short time, reproducing realistic failure modes.
-
As highly efficient screening tools, our methods can be used to quickly identify weak points in components and causes of failure, significantly accelerating optimal material selection and process design.
Accelerated fatigue testing has been proposed as an alternative to time consuming conventional thermal and power cycling test procedures.
The principal idea of AMT is replacement of thermally induced stresses by means of equivalent mechanical stresses by using dedicated high frequency testing systems.
Based on a physics of failure (PoF) approach, the mechanical fatigue testing systems are specially designed to replicate the dominating loading conditions and encountered failure mechanisms occurring during the operation of electronic devices.
THE ADVANTAGES OF OUR METHODS ARE:
-
extreme time saving screeing tool compared to conventional test methods (factor 1,000 and more) "time to market"
-
applicable to a broad range of material combinations and dimensions (nm up to cm)
-
reproducing realistic failure modes in a very short time
-
efficient substitution of environmentally harmful materials and auxiliary materials
-
already proven in practice - many our developed test systems are already successfully in use
Equipment
-
Ultrasonic resonance fatigue testing systems working at 20 kHz and 36 kHz, equipped following testing configurations:
-
Symmetrical tension-compression loading mode
-
Dynamic three and four point bending loading mode
-
Optical system and software for crack growth rate measurements / determination of stress intensity factors
-
Set-up for high cycle fatigue testing of small-scaled specimens
-
-
Electromagnetic shaker systems operating up to ~ 10 Hz
-
Piezoelectric shaker systems (various types working in pull-push and shear modes) operating up to ~ 100 kHz
-
Micro-tensile machines for small-scaled samples
-
Load capacities in the range of 1N to 1000N
-
Laser speckle extensometers for non-contact strain measurements
-
Bending rigs (3PB, 4PB)
-
Temperature chamber (up to 300°C)
-
Static and cyclic tests
-
-
Tensile machine with load capability up to 5000N
-
Wire Bonder & Tester (BondTec)
-
Thick Wire Bonder
-
BAMFIT – (Rapid bond fatigue tester)
-
Pull Tester
-
Shear Tester
-
-
Differential Laser Doppler Vibrometers type Polytec CLV 1000, Set-up for 3D vibration measurements
-
Optical Microphone (XARION's Eta100 Ultra) - laser-based sensors for acoustic measurements with a frequency bandwidth from 10 Hz to 1MHz
-
Reflow soldering oven
1/1
WE ESPECIALLY OFFER SOLUTIONS FOR:
-
Users, manufacturers of semiconductor components
◦ Automotive industry and its suppliers
◦ Aerospace industry
◦ LED
-
Medical technology
◦ Structural analysis
◦ Material analysis/selection
-
Coated materials with (high/special) requirements for reliability or service life
◦ Medical technology
◦ Toolmaking, machinery and plant engineering
-
Functional coatings
-
Thin-film coatings, lacquers
-
Manufacturers and users of materials for
◦ Soldering and sintering technology
◦ Welding technology
◦ Adhesive bonding technology
-
Manufacturer of
◦ Printed circuit boards
◦ Composite materials
References
bottom of page